knowledges

What Are The Main Performance Requirements Of The Target?

2024-01-05 18:00:06

   The main performance requirements of targets are:

    purity

   Purity is one of the main performance indexes of target, because the purity of its material has great influence on the performance of film. However, in practical applications, the purity requirements of its materials are also different. For example, with the rapid development of the microelectronics industry, the size of silicon wafer is from 6, 8 "to 12", and the wiring width is reduced from 0.5um to 0.25um, 0.18um or even 0.13um. In the past 99.995% of the target material purity can meet the technical requirements of 0.35umIC, while the preparation of 0.18um wire requires 99.999% or even 99.9999% of the target material purity.


   Impurity content

   The impurities in the solid , the oxygen and water vapor in the pores are the main sources of the deposited films. Different targets have different requirements for various impurity contents. For example,Resisting High Temperature Corrosion Disc Shape Tantalum Sputtering Target,

pure aluminum and aluminum alloy materials used in semiconductor industry have special requirements for alkali metal content and radioactive element content.

 Titanium-Sputtering-Target-Ti-99-99-Pure_350x350.png

   density

  In order to reduce the porosity in target solids and improve the properties of sputtered films, the target materials are usually required to have high density. The density does not only affects the sputtering rate, but also affects the electrical and optical properties of the films. The higher the target density, the better the performance of the film. In addition, increasing the density and strength of the target will enable the target to better withstand the thermal stress during sputtering. Density is also one of the key performance indicators .

 

   Grain size and grain size distribution

   Usually, the target is polycrystalline structure, and the grain size can be from micron to millimeter. For the same target, the sputtering rate o with small grain size is faster than with large grain size, and the thickness distribution of the thin film deposited by the target with small grain size difference (uniform distribution) is more uniform.

 learn more information about Resisting High Temperature Corrosion Disc Shape Tantalum Sputtering Target


YOU MAY LIKE

Molybdenum Holder

Molybdenum Holder

View More
niobium seamless pipe

niobium seamless pipe

View More
WLa electrodes

WLa electrodes

View More
tungsten filament wire

tungsten filament wire

View More
pure tungsten bar

pure tungsten bar

View More
Seamless Nickel Alloy Pipe

Seamless Nickel Alloy Pipe

View More