Sputtering is one of the main technologies of physical vapor deposition (PVD) technology, which is used repeatedly in the manufacturing of VLSI. It uses ions generated by ion source to accelerate the accumulation in high vacuum to form high-speed ion beam, bombarding the solid surface, ions and atomic emission on the solid surface. The exchange of kinetic energy causes the atoms on the solid surface to leave the solid and deposit on the base surface. The bombarded solid is the raw material used to deposit thin films by sputtering method, which is called sputtering target.

   Generally speaking, the sputtering target is mainly composed of target blank, backplane and other parts. Among them, target blank is the target material bombarded by high-speed ion beam and belongs to the core part of the sputtering target. In the sputtering process, after the target blank is hit by ion, the surface atoms of the target blank are sputtered and deposited on the substrate to form an electronic film; because of the low strength of high purity metal, the sputtering target material is produced by sputtering. The sputtering process needs to be installed in a dedicated platform. The internal environment of the platform is high voltage and high vacuum. Therefore, the sputtering target blank of ultra-high purity metal needs to be joined with the back plate through different welding processes. The back plate plays the main role of fixing the sputtering target, and needs to have good conductivity and thermal conductivity.

   There are many kinds of sputtering target materials, even the same material have different specifications. According to different classification methods, sputtering targets can be divided into different categories, the main classification is as follows:

   Classification by shape: long target, square and round target

   Classified by chemical composition: metal target (pure metal aluminum, titanium, copper, tantalum, etc.), alloy target (nickel-chromium alloy, nickel-cobalt alloy, etc.), ceramic compound target (oxide, silicide, carbide, sulfide, etc.)

   Classified by application field: semiconductor chip target, flat panel display , solar cell, information storage, tool modified, electronic device, other target